Semiconductor fabs require ultra-high purity components throughout their wet processing operations. GFT9 products serve critical functions in chemical delivery, wet bench processing, and facility systems.
Wet Etching Systems
Wet etching uses aggressive chemicals to selectively remove material from wafer surfaces. Hydrofluoric acid (HF) etches silicon dioxide. Phosphoric acid etches silicon nitride at elevated temperatures. Piranha etch (sulfuric acid + hydrogen peroxide) removes organic contamination. PFA-lined valves control chemical flow to wet benches while maintaining the purity required for defect-free processing.
Wafer Cleaning (RCA Clean)
The RCA cleaning process—developed at RCA Laboratories and still widely used—employs SC1 (ammonium hydroxide + hydrogen peroxide) and SC2 (hydrochloric acid + hydrogen peroxide) solutions to remove organic and metallic contamination from wafer surfaces. PFA-lined components handle these oxidizing mixtures without degradation or contamination.
Chemical Delivery Systems
Bulk chemicals must be delivered from storage to point-of-use without contamination. Chemical delivery systems use PFA-lined valves to control flow from drums or bulk tanks through distribution manifolds to individual process tools. Sight glasses enable visual verification of chemical flow and level.
Ultra-Pure Water (UPW) Systems
Semiconductor-grade ultra-pure water systems achieve resistivity of 18.2 MΩ·cm with parts-per-trillion contamination levels. PFA-lined valves maintain water purity throughout distribution systems, from generation through final delivery to wet benches and rinse stations.
Chemical Recirculation and Temperature Control
Many wet processes require precise temperature control of chemical baths. Recirculation systems move chemicals through heaters or chillers and back to process tanks. PFA-lined valves and sight glasses in these loops must withstand continuous chemical exposure at elevated or reduced temperatures.